As chip manufacturing continues to advance—from 7 nm to 3 nm—the requirements for encapsulation and protection materials have become extremely demanding, and silicone has become an indispensable material thanks to its precisely tailored properties. The stability of a chip depends heavily on its external protection, and silicone forms the core of this “protective armor.”
High-purity, electronic-grade silicone is standard for advanced chips, with metal ion content controlled to the ppb (billionth) level—even trace impurities can cause computational instability. In packaging, silicone potting compounds form dense protective layers that resist temperature fluctuations from −60 °C to 200 °C, as well as moisture and chemical corrosion, ensuring stable operation under harsh conditions. For advanced Chiplet packaging technologies, silicone materials overcome key barriers—the dielectric constant must remain between 2.8 and 3.2 and the dissipation factor below 0.002—to minimize signal delay and ensure efficient multi-chip communication.
In PCB protection, silicone coatings form ultra-thin insulation layers that preserve heat dissipation while enhancing impact and wear resistance. From smartphone chips to industrial-grade server processors, continuous silicone innovation is meeting the semiconductor industry’s high-end demands—silently driving chip evolution.