With the development of electronic equipment in the direction of high performance and miniaturization, the demand for electronic packaging materials is increasing day by day.With its excellent heat resistance, electrical insulation and chemical stability, high-temperature resistant silicone resin products have become the new favorite in the field of electronic packaging.This article will discuss the five major technological breakthroughs of high temperature resistant silicone resin products and their application in electronic packaging.


1. Nano enhancement technology
By introducing fillers such as nano-silica (SiO₂) and silicon carbide (SiC), the mechanical strength and temperature resistance limits of silicone resins are significantly improved.For example, nano-SiO₂ modified silicone resins can be used for a long time at 300°C, withstand temperatures up to 500°C in the short term, and increase hardness by 30%.


2. Design with low coefficient of thermal expansion
By optimizing the molecular structure of the silicone resin, reducing its coefficient of thermal expansion, matching it with the coefficient of thermal expansion of electronic components, and reducing the problem of package cracking caused by thermal stress.For example, silicone resins with a low coefficient of thermal expansion can still maintain stable packaging performance in high temperature environments.


3. High thermal conductivity formula
By adding high thermal conductivity fillers (such as aluminum nitride and alumina), the thermal conductivity of silicone resin is improved so that it can still effectively dissipate heat in high temperature environments.For example, high thermal conductivity silicone resin is used in the packaging of power devices, which can quickly conduct heat to the heat sink and improve the stability of the equipment.


4. Self-healing function development
By introducing a microencapsulated silane coupling agent, the silicone resin can self-repair local damage at high temperatures.For example, the “Smart Coating” developed by NASA in the United States at a high temperature of 500°C, the microcapsules at the cracks in the coating break and release repair agents, which quickly fill the defects through the siloxane condensation reaction.


5. Environmentally friendly silicone resin
Develop low VOC (volatile organic compounds) and water-based silicone resins to reduce environmental pollution during production and use.For example, the application of water-based silicone resin in electronic packaging not only reduces VOC emissions, but also improves construction safety.


The five major technological breakthroughs in high-temperature resistant silicone resin products have brought revolutionary changes to the field of electronic packaging.With the continuous progress of technology, the application of silicone resin in electronic packaging will be more extensive and efficient.