“Power modules failing right out of the factory? Encapsulant full of bubbles, cracking, or peeling after high-temperature aging?” Such failures are costly. Surveys show that VOCs exceeding limits cause >18% device failures, with single-batch losses reaching tens of thousands of dollars. Experts warn: low-volatility silicone is essential. Excessive volatile content is the main cause of board failures, bubbles, and compliance issues.
A recent case: automotive power modules using standard silicone showed 50% cracking and some board explosions during 85℃ aging tests. High-volatility small molecules vaporized, expanded, formed bubbles, and caused short circuits—direct losses >300,000 yuan. Some consumer electronics failed RoHS compliance due to high VOCs, canceling export orders.
Electronic devices generate heat. In a sealed environment, volatiles in standard silicone vaporize, creating pressure. Minor effect: bubbles, cracks, loss of insulation; severe: board explosion.
Low-volatility silicone reduces small-molecule content via molecular optimization, remains stable from -60℃ to 200℃, and forms a dense protective layer even after high-temperature aging, effectively preventing bubbles and cracking.
Low-volatility silicone meets IPC, UL, RoHS standards. Experts recommend VOC <50ppm. One communication equipment company solved high-temperature bubble issues and passed UL94 flame rating, raising yield from 92% to 99.5%.
Practical experience shows low-volatility silicone improves quality and reduces costs. With electronics trending toward high power and miniaturization, low-volatility silicone is becoming the core material for encapsulants, and customized formulations matching operating conditions are emerging as the industry standard, ensuring both reliability and compliance.
