In 2026, surging global photovoltaic (PV) installations are fueling renewed demand for organosilicon as a critical encapsulation and sealing material. According to China’s National Energy Administration, new PV capacity reached 38 GW in January–February 2026—a 41% year-on-year increase. Meanwhile, N-type cells (TOPCon, HJT) now hold over 55% market share, up nearly 20 percentage points since 2024. This technological shift directly boosts high-performance silicone usage.
While P-type modules traditionally used EVA encapsulants, N-type cells—requiring higher efficiency and reliability—increasingly adopt hybrid “POE + EVA + silicone” schemes. Organosilicon is used for junction box sealing, frame bonding, and edge protection, valued for its anti-PID properties, UV resistance, and elasticity across –50°C to 150°C. Leading module makers report 80–120 grams of silicone per N-type panel—about 30% more than P-type.
Additionally, dual-glass module penetration has exceeded 45%, raising structural adhesion demands. Some manufacturers are even testing full-silicone encapsulation, which, though costlier, extends service life by 5–8 years in extreme environments like deserts or offshore sites.
