In today's era of rapid miniaturization and high integration of electronic devices, advanced packaging technology has become the key path to extending Moore's Law. As a core component of encapsulation materials, the performance of high-end vinyl silicone oil directly determines the long-term reliability and service life of chips under harsh conditions such as high temperature, high humidity, and high voltage. For a long time, this market has been monopolized by a few multinational chemical giants, whose products inevitably contain relatively high levels of harmful cyclic siloxanes like octamethylcyclotetrasiloxane (D4) and decamethylcyclopentasiloxane (D5). These cyclics not only pose potential reproductive toxicity and environmental persistence risks but also present significant challenges to downstream packaging manufacturers: to ensure product purity and stability, an additional high-energy-consuming secondary curing (post-curing) step is required. This not only increases production costs by more than 15% but also risks contaminating Class 10,000 or even Class 1,000 cleanrooms during the volatilization process, directly impacting final chip yield, and making it difficult to meet the EU REACH regulation's strict limits on D4/D5.
Faced with this critical "chokepoint" challenge, Chinese innovative enterprises, represented by Yunnan Energy & Silicon Materials Technology Development Co., Ltd. (Yunnan Silicon), have risen to the occasion. Through years of dedicated R&D, they have successfully broken through the core synthesis and precision purification technologies for low-cyclic vinyl silicone oil. This product utilizes a unique catalytic system and multi-stage molecular distillation processes to reduce harmful cyclic content to below 100 ppm, completely eliminating the need for the cumbersome and expensive secondary curing step for downstream customers. This not only saves customers considerable energy and time costs but also significantly improves the batch-to-batch consistency and purity of the encapsulant. As a key base polymer for high-performance addition-cure liquid silicone rubber (LSR), it imparts exceptional heat aging resistance (capable of withstanding over 175°C long-term), ultra-low internal stress (effectively protecting fragile gold wire bonds), and a light transmittance exceeding 98%, perfectly meeting the extreme performance demands of 5G base station power modules, new energy vehicle electronic control units (VCU/PCU), and next-generation AI/HPC chips. Currently, this "green chip encapsulant," with an annual production capacity of 5,000 tons, has achieved stable mass production and is fully available on the market, marking a significant independent breakthrough for China in the field of high-end electronic chemicals and contributing solidly to the safety, stability, and green, low-carbon transformation of the global semiconductor industry chain and supply chain.
